What’s new in Renesas FSP 4.6.0?
The Flexible Software Package (FSP) for the Renesas RA microcontroller family has been updated to version 4.6.0. This release focuses on new connectivity features, security enhancements, and a refresh of the development toolchain.
Key feature additions
- DA16600 Wi‑Fi support – native driver and example code for the DA16600 module.
- Trusted Firmware‑M (TFM) support for RA6M5 – enables secure boot and runtime isolation.
- CAN‑FD transmit FIFO (Common FIFOs) – improves CAN‑FD throughput and determinism.
- Memory optimisations for on‑chip MQTT drivers on DA16XXX modules.
Toolchain and IDE updates
The release bundles the latest versions of the supported compilers and IDEs:
- GCC 12.2
- IAR 9.40.1
- ARM Compiler 6.19
- e2 studio 2023‑07 (minimum required version)
- Renesas Advanced Smart Configurator (RASC) 2023‑07
- SEGGER J‑Link 7.88n
- SEGGER emWin 6.34
Download options
Installers are provided for the major development environments:
- Windows installer for e2 studio:
setup_fsp_v4_6_0_e2s_v2023-07.exe - Linux AppImage for e2 studio:
setup_fsp_v4_6_0_e2s_v2023-07.AppImage - Renesas Advanced Smart Configurator (RASC) installer:
setup_fsp_v4_6_0_rasc_v2023-07.exe
All files are available in the GitHub release assets.
Third‑party components
FSP 4.6.0 ships with updated third‑party libraries, including Amazon FreeRTOS components, ARM CMSIS‑5, Mbed TLS, MCUboot 1.10, and Microsoft Azure RTOS suites.
Known issues and fixes
Several bugs were addressed, such as invalid default clocks on the CK‑RA6M5, QSPI pin configuration on RA4E1‑48, and ADC hybrid‑mode filter problems. For a full list, see the closed issues for this milestone.
Developers targeting Renesas RA devices should upgrade to FSP 4.6.0 to take advantage of the new Wi‑Fi driver, security firmware, and the latest compiler support.