Renesas Flexible Software Package (FSP) v6.5.1 Release Overview

Vendor claim: Renesas released Flexible Software Package (FSP) version 6.5.1 for the RA MCU family.

Vendor claim: This release includes packs that are installed separately from e2 studio, and the v6.5.0 platform installer must be installed first before adding the new packs.

Vendor claim: A bug fix addresses SDRAM initialization during startup.

Vendor claim: SHA‑256 checksums are provided for each downloadable archive (FSP_Packs_v6.5.1.zip, FSP_Packs_v6.5.1.exe, fsp_documentation_v6.5.1.zip, MDK_Device_Packs_v6.5.1.zip).