Renesas FSP v6.4.0: RA0E3 Support, Motor Control Updates, and Critical Fixes

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Renesas FSP v6.4.0 Release Notes

Renesas has released version 6.4.0 of the Flexible Software Package (FSP) for the RA MCU family. This update requires e2 studio 2025-12 as the minimum supported environment.

Installation

Installers are available for Windows, Linux, and macOS. For users of IAR or Keil MDK, the Renesas Advanced Smart Configurator (RASC) is also provided.

  • Windows: setup_fsp_v6_4_0_e2s_v2025-12.exe and setup_fsp_v6_4_0_rasc_v2025-12.exe
  • Linux: setup_fsp_v6_4_0_e2s_v2025-12.xz.run and setup_fsp_v6_4_0_rasc_v2025-12.xz.run
  • macOS (Apple Silicon): setup_fsp_v6_4_0_e2s_v2025-12.pkg and setup_fsp_v6_4_0_rasc_v2025-12.pkg

New Features

Renesas has expanded support for new hardware and middleware capabilities:

  • Hardware Support: Added support for the RA0E3 device and the FPB-RA0E3 board. Support for the EK-RA8T2 board includes the VSC8541 PHY.
  • Motor Control Middleware: Introduced Trajectory module support, HAL driver support, and support for Hall sensor and BEMF sensor modules. A new PM FOC motor algorithm and Motor Tuning module for permanent magnet motors have been released.
  • RSIP Crypto Drivers: Added HMAC-SHA 512/224 and 512/256 support for RSIP-E51A and RSIP-E50D PM drivers. Added KDF-SHA 512 support and features to verify public key certificates and import keys using RSA algorithms on the same drivers. A new CAVP certified module was released for RSIP-E31A.
  • Network & Protocols: Added support for lwIP SNTP application and gPTP middleware. Added xDLMS InitiateRequest message decryption on RSIP-E31A PM driver.
  • Other Updates: Added support for 24-pin packages R7FA2T1073CNK and R7FA2T1074CNK. Arm Compiler for Embedded (Arm Compiler 6) was updated to version 6.24.

Fixes and Improvements

This release addresses several build failures and configuration issues:

  • Build Fixes: Resolved an IAR compiler build failure when using the PQC crypto module with RA8 devices. Fixed GCC C++ build warnings in the ThreadX port.
  • MCUBoot: Fixed build failures when the Flash LP Bank Swap setting is configured to Instant. Added ML-DSA support for MCUboot signing.
  • PQC Module: Fixed an edge case in PQC where a NULL check prevented a valid 0x00000000 address from being used as a pointer.
  • Pin Configuration: Removed AES-XTS key injection feature for RSIP-E31A according to the support policy. Moved GTETRGx pins from GPT to GPT_POEG in RA6T2 Pin page.
  • Drivers: Added SPI support to r_ble_gtl. Updated r_rmac driver to support L2 over L3 fabric. Added UART_EVENT_TX_DATA_EMPTY event for SAU UART.
  • Configuration: Simplified OSPI_B MDF configuration. Corrected the configuration for L3 forwarding feature in r_layer3_switch. Added constraint to check etherc buffer to netxduo.
  • Memory & DMA: Added support for 8-byte transfer size options in DTC and DMAC. Secure and privilege attributes for NPU to access memories must now be configured via properties.

Known Issues

Users should be aware of the following issues and workarounds:

  • TrustZone/Multicore: There are issues related to pin configuration synchronization between projects in e2 studio 2025-12. A workaround document is available.
  • RA0E1: e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation. Users must manually add optimization flags (e.g., -O0) to override this. HS400x and ZMOD4xxx sensors cannot be used on RA0E1. FS3000 sensor does not support SAU-I2C driver.
  • EWARM: EWARM version 9.70.2 does not contain support for RA0E3. A patch file is required.
  • Upgrades: When upgrading RA6T2 projects to FSP 6.4.0, GTETRGx pin assignments might be lost. When upgrading RA0E1/E2/L1 projects, the SAU_SPI00 pin group might be changed.
  • USBX Composite: When using USBX composite device (PCDC+PMSC), issues may occur with safely removing hardware on Windows or proper operation on specific Linux USB Hosts.

Third Party Software

This release bundles the following third-party software versions:

  • Arm Compiler 6.24
  • lwIP 2.2.0
  • MCUboot 2.1.0
  • Arm CMSIS 6.1.0
  • Arm CMSIS-DSP 1.16.2
  • Azure RTOS ThreadX 6.4.0
  • Azure RTOS NetX Duo 6.4.0

SHA-256 checksums for all major files are provided in the release assets.